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Standards Worldwide
Standards Worldwide
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Energie- und Elektrotechnik

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Standard [CURRENT] 2020-03

DIN EN 60068-2-69:2020-03; VDE 0468-2-69:2020-03
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019

115.04 EUR VAT included

107.51 EUR VAT excluded

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Standard [CURRENT] 1994-09

DIN EN 60917-2:1994-09
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994

from 70.50 EUR VAT included

from 65.89 EUR VAT excluded

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Standard [CURRENT] 2022-08

DIN EN IEC 61188-6-1:2022-08
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021

from 123.40 EUR VAT included

from 115.33 EUR VAT excluded

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Standard [CURRENT] 2023-03

DIN EN IEC 61188-6-2:2023-03
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021

from 117.70 EUR VAT included

from 110.00 EUR VAT excluded

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Draft standard 2022-04

DIN EN IEC 61188-6-3:2022-04 - Draft
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

from 106.30 EUR VAT included

from 99.35 EUR VAT excluded

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Standard [CURRENT] 2020-04

DIN EN IEC 61188-6-4:2020-04
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019

from 141.20 EUR VAT included

from 131.96 EUR VAT excluded

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Standard [CURRENT] 2017-12

DIN EN 61188-7:2017-12
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017

from 106.30 EUR VAT included

from 99.35 EUR VAT excluded

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Standard [CURRENT] 2023-12

DIN EN IEC 61189-2-501:2023-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

from 99.10 EUR VAT included

from 92.62 EUR VAT excluded

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Standard [CURRENT] 2019-03

DIN EN IEC 61189-2-630:2019-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018

from 63.80 EUR VAT included

from 59.63 EUR VAT excluded

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Standard [CURRENT] 2017-04

DIN EN 61189-2-719:2017-04
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016

This part of 61189 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 ...

from 99.10 EUR VAT included

from 92.62 EUR VAT excluded

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