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Standard [CURRENT]

DIN EN IEC 61188-6-2:2023-03

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021

German title
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-2: Anschlussflächen – Beschreibung der Anschlussflächen für die meisten oberflächenmontierbaren Bauelemente (SMD, en: surface mounted components) (IEC 61188-6-2:2021); Deutsche Fassung EN IEC 61188-6-2:2021
Publication date
2023-03
Original language
German
Pages
29

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Publication date
2023-03
Original language
German
Pages
29
DOI
https://dx.doi.org/10.31030/3375990

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ICS
31.180, 31.190
DOI
https://dx.doi.org/10.31030/3375990

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