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Standards Worldwide
Standards Worldwide
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Energie- und Elektrotechnik

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Standard [CURRENT] 1986-12

DIN 41494-8:1986-12
Mechanical structures for electronic equipment; mechanical structures of the 482,6 mm (19")series; components on front panels; mounting conditions, dimensions

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Standard [CURRENT] 1989-09

DIN 41593:1989-09
Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

from 63.80 EUR VAT included

from 59.63 EUR VAT excluded

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Standard [CURRENT] 1976-02

DIN 41618-4:1976-02
Multipole connectors with blade contacts 2,5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622

from 24.60 EUR VAT included

from 22.99 EUR VAT excluded

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Standard [CURRENT] 2018-10

DIN EN IEC 60191-1:2018-10
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

from 141.20 EUR VAT included

from 131.96 EUR VAT excluded

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Standard [CURRENT] 2000-07

DIN EN 60191-3:2000-07
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

from 146.40 EUR VAT included

from 136.82 EUR VAT excluded

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Technical rule [CURRENT] 2006-08

DIN EN 60191-3 Beiblatt 1:2006-08
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

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Standard [CURRENT] 2019-02

DIN EN 60191-4:2019-02
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018

from 129.30 EUR VAT included

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Standard [CURRENT] 2010-06

DIN EN 60191-6:2010-06
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009

This part of DIN EN 60191 contains general rules for the preparation of outline drawings of surface mounted semiconductor devices. It supplements DIN EN 60191-1 and DIN EN 60191-3 with ...

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Standard [CURRENT] 2002-08

DIN EN 60191-6-1:2002-08
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

from 56.60 EUR VAT included

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Standard [CURRENT] 2002-09

DIN EN 60191-6-2:2002-09
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

from 77.90 EUR VAT included

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