Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
German title
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente (IEC 60191-4:2013 + A1:2018); Deutsche Fassung EN 60191-4:2014 + A1:2018
Publication date
2019-02
Original language
German
Pages
39
Publication date
2019-02
Original language
German
Pages
39
DOI
https://dx.doi.org/10.31030/3007019
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.