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Standards Worldwide
Standards Worldwide
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Energie- und Elektrotechnik

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Standard [CURRENT] 2013-10

DIN 51456:2013-10
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)

This document specifies a method for the determination of the mass fractions of the elements Al (aluminium), As (arsenic), Ba (barium), Be (beryllium), Ca (calcium), Cd (cadmium), Co (cobalt), Cr ...

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Standard [CURRENT] 2018-04

DIN EN 60747-16-3:2018-04
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017

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Standard [CURRENT] 2005-03

DIN EN 60747-16-10:2005-03
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004

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Standard [CURRENT] 1994-09

DIN EN 60821:1994-09
IEC-821-VMEbus - Microprocessor system bus for 1 byte to 4 byte data (IEC 60821:1991, modified); German version EN 60821:1994

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Standard [CURRENT] 2002-10

DIN EN 61523-1:2002-10
Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems (IEC 61523-1:2001); German version EN 61523-1:2002, text in English

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Standard [CURRENT] 2003-06

DIN EN 61523-2:2003-06
Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries (IEC 61523-2:2002); German version EN 61523-2:2002, text in English

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Standard [CURRENT] 2001-10

DIN EN 61943:2001-10
Integrated circuits - Manufacturing line approval application guideline (IEC 61943:1999); German version EN 61943:1999

from 102.10 EUR VAT included

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Standard [CURRENT] 2000-01

DIN EN 61964:2000-01
Integrated circuits - Memory devices pin configurations (IEC 61964:1999); German version EN 61964:1999

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Standard [CURRENT] 2019-09

DIN EN IEC 61967-1:2019-09; VDE 0847-21-1:2019-09
Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions (IEC 61967-1:2018); German version EN IEC 61967-1:2019

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Standard [CURRENT] 2006-03

DIN EN 61967-2:2006-03
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005

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