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Standards Worldwide
Standards Worldwide
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Energie- und Elektrotechnik

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Standard [CURRENT] 2017-10

DIN EN 60747-16-1:2017-10
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017

This part of IEC 60747 provides the terminology, the ratings and characteristics, as well as the measuring methods for microwave integrated circuit power amplifiers. Compared to DIN EN 60747-16-1 ...

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Standard [CURRENT] 2018-04

DIN EN 60747-16-4:2018-04
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017

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Standard [CURRENT] 2021-08

DIN EN 60747-16-5:2021-08
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020

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Standard [CURRENT] 2021-08

DIN EN IEC 60747-16-6:2021-08
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019

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Standard [CURRENT] 2024-04

DIN EN IEC 60747-16-7:2024-04
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023

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Standard [CURRENT] 2024-04

DIN EN IEC 60747-16-8:2024-04
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022); German version EN IEC 60747-16-8:2023

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Draft standard 2022-06

DIN EN IEC 60747-16-9:2022-06 - Draft
Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English

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Standard [CURRENT] 2017-04

DIN EN 62047-25:2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016

The main structural materials for MEMS, microcomponents and so on have special properties such as dimensions in the micrometer range, material manufacturing processes using layer deposition and ...

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Standard [CURRENT] 2024-09

DIN EN IEC 62477-1:2024-09; VDE 0558-477-1:2024-09
Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2022 + COR1:2024); German version EN IEC 62477-1:2023 + AC:2024

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Standard [CURRENT] 2019-06

DIN EN IEC 62477-2:2019-06; VDE 0558-477-2:2019-06
Safety requirements for power electronic converter systems and equipment - Part 2: Power electronic converters from 1 000 V AC or 1 500 V DC up to 36 kV AC or 54 kV DC (IEC 62477-2:2018); German version EN IEC 62477-2:2018

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