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Standard [NEW]

DIN EN IEC 63215-2:2025-03

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023

German title
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 2: Verfahren für die Temperaturwechselprüfung von Werkstoffen zum Chip-Bonden von leistungseektronischen Bauelementen (IEC 63215-2:2023); Deutsche Fassung EN IEC 63215-2:2023
Publication date
2025-03
Original language
German
Pages
25

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Publication date
2025-03
Original language
German
Pages
25
DOI
https://dx.doi.org/10.31030/3585721

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ICS
31.190
DOI
https://dx.doi.org/10.31030/3585721
Replacement amendments
Document timeline
CURRENT STANDARD
2025-03 - 2025-03

Standard [NEW]

DIN EN IEC 63215-2:2025-03
WITHDRAWN
2021-01 - 2025-03

Draft standard [WITHDRAWN]

DIN EN IEC 63215-2:2021-01

Cooperation at DIN

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