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Draft standard

DIN EN IEC 63215-2:2021-01 - Draft

Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English

German title
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden zur Verwendung an leistungselektronischen Bauelementen - Teil 2: Verfahren für die Temperaturwechselprüfung und Funktionsfähigkeitsindex von Werkstoffen zum Chip-Bonden zur Verwendung an leistungselektronischen Bauelementen (IEC 91/1660/CD:2020); Text Deutsch und Englisch
Date of issue
2020-12-11
Publication date
2021-01
Original language
German, English
Pages
40

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Date of issue
2020-12-11
Publication date
2021-01
Original language
German, English
Pages
40
DOI
https://dx.doi.org/10.31030/3218257

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ICS
31.190
DOI
https://dx.doi.org/10.31030/3218257

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