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Standard [CURRENT]

DIN EN IEC 60749-20:2023-07

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2020); Deutsche Fassung EN IEC 60749-20:2020
Publication date
2023-07
Original language
German
Pages
30

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Publication date
2023-07
Original language
German
Pages
30
DOI
https://dx.doi.org/10.31030/3409802

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3409802
Replacement amendments

This document replaces DIN EN 60749-20:2010-04 .

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