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Standard [WITHDRAWN]

DIN EN 60749-20:2010-04

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2008); Deutsche Fassung EN 60749-20:2009
Publication date
2010-04
Original language
German
Pages
28

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Publication date
2010-04
Original language
German
Pages
28
DOI
https://dx.doi.org/10.31030/1570070

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/1570070
Replacement amendments

This document replaces DIN EN 60749-20:2003-12 .

This document has been replaced by: DIN EN IEC 60749-20:2023-07 .

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