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Standard [WITHDRAWN]

DIN EN 60749-20:2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2002 + Corr. 1:2003); Deutsche Fassung EN 60749-20:2003
Publication date
2003-12
Original language
German
Pages
25

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Publication date
2003-12
Original language
German
Pages
25

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Replacement amendments

This document replaces DIN EN 60749:2002-09 .

This document has been replaced by: DIN EN 60749-20:2010-04 .

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