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Standard [WITHDRAWN]

DIN EN 61190-1-2:2003-01

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-2:2002); Deutsche Fassung EN 61190-1-2:2002
Publication date
2003-01
Original language
German
Pages
19

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Publication date
2003-01
Original language
German
Pages
19

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Replacement amendments

This document has been replaced by: DIN EN 61190-1-2:2007-11 .

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