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Standard [WITHDRAWN]

DIN EN 61190-1-2:2007-11

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-2:2007); Deutsche Fassung EN 61190-1-2:2007
Publication date
2007-11
Original language
German
Pages
22

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Publication date
2007-11
Original language
German
Pages
22

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Replacement amendments

This document replaces DIN EN 61190-1-2:2003-01 .

This document has been replaced by: DIN EN 61190-1-2:2014-11 .

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