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Standard [WITHDRAWN]

DIN EN 60749-21:2005-06

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2004); German version EN 60749-21:2005

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit (IEC 60749-21:2004); Deutsche Fassung EN 60749-21:2005
Publication date
2005-06
Original language
German
Pages
21

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Publication date
2005-06
Original language
German
Pages
21

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Replacement amendments

This document replaces DIN EN 60749:2002-09 .

This document has been replaced by: DIN EN 60749-21:2012-01 .

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