DIN EN 60749-21:2012-01

This part of DIN EN 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method is generally in accordance with the tests given in DIN EN 60068-2, but due to specific requirements for semiconductors, the clauses of this standard shall be applied. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test method does not assess the effects of thermal stresses which may occur during the soldering process. For these effects, reference should be made to the specifications of DIN EN 60749-15 or DIN EN 60749-20. This standard replaces DIN EN 60749-21:2005-06. The following modifications have been made: a) specifications on lead-free backward compatibility have been included; b) editorial revision. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.