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Standard [CURRENT]

WL 5.4111:1998-10

Aerospace - Structural adhesive films on a modified EP basis - Standard curing temperature 175 °C, applicable from - 55 °C to 135 °C

German title
Luft- und Raumfahrt - Strukturelle Klebfolien, Basis modifiziertes EP-System - Standardhärtungstemperatur 175 °C, einsetzbar von - 55 °C bis 135 °C
Publication date
1998-10
Original language
German
Pages
7

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Publication date
1998-10
Original language
German
Pages
7

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