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IEC 60749-35:2006-07
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 35: Ultraschallmikroskopie für kunststoffverkappte Bauelemente der Elektronik
- Publication date
-
2006-07
- Original language
-
English,
French
- Pages
- 43
- Publication date
-
2006-07
- Original language
-
English,
French
- Pages
- 43
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