Standard
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IEC 60749-19 AMD 1:2010-07
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit
- Publication date
-
2010-07
- Original language
-
English,
French
- Pages
- 4
- Publication date
-
2010-07
- Original language
-
English,
French
- Pages
- 4
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