IEC 60749-10:2022-04

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe
Publication date: 2022-04
Original language: English, French
Pages: 24

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