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Standard [CURRENT]

DIN EN IEC 61190-1-3:2018-09

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 61190-1-3:2017); Deutsche Fassung EN IEC 61190-1-3:2018
Publication date
2018-09
Original language
German
Pages
44

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Publication date
2018-09
Original language
German
Pages
44
DOI
https://dx.doi.org/10.31030/2854461

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ICS
31.190
DOI
https://dx.doi.org/10.31030/2854461
Replacement amendments

This document replaces DIN EN 61190-1-3:2011-04 .

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