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This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for flux-cored and solid solders in the form of rods, bars, sticks, ribbon, solder powder and solder paste, for electronic soldering applications and for special electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and does not relate directly to the material characteristics in the manufacturing process. Special electronic grade solders include all solders which are not fully covered by the requirements listed in this standard for standard soldered alloys and solder materials. Some examples of special solders are anodes, blocks, moulded parts, rods with hooks and eyes at the ends, multi-component solder powder, and so on. The responsible Committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology ") of the DKE (German Commission for Electrical, Electronic and Informational Technologies) at DIN and VDE.
This document replaces DIN EN 61190-1-3:2007-11 .
This document has been replaced by: DIN EN IEC 61190-1-3:2018-09 .
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