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Standard [CURRENT]

DIN EN IEC 61189-2-807:2023-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-807: Prüfverfahren für Materialien für Verbindungsstrukturen - Zersetzungstemperatur (Td) unter der Nutzung von TGA (IEC 61189-2-807:2021); Deutsche Fassung EN IEC 61189-2-807:2021
Publication date
2023-01
Original language
German
Pages
11

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Publication date
2023-01
Original language
German
Pages
11
DOI
https://dx.doi.org/10.31030/3385876

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ICS
31.180, 31.190
DOI
https://dx.doi.org/10.31030/3385876

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