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Standard [CURRENT]

DIN EN IEC 60749-15:2022-05

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2020); Deutsche Fassung EN IEC 60749-15:2020
Publication date
2022-05
Original language
German
Pages
11

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Publication date
2022-05
Original language
German
Pages
11
DOI
https://dx.doi.org/10.31030/3319203

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3319203
Replacement amendments

This document replaces DIN EN 60749-15:2011-06 .

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