DIN EN 60749-15:2011-06

This part of DIN EN 60749 specifies a procedure used to determine whether encapsulated solid state devices used for through-hole mounting can withstand thermal effects to which the mounted devices are subjected during soldering of their leads, namely both during wave soldering and when using a soldering iron. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations without degrading their electrical characteristics or internal connections. This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements for semiconductors, the specifications of this standard shall apply. This standard replaces DIN EN 60749-15:2003. The significant changes with regard to the previous standard include: - addition of lead-free solder chemical composition of specifications; - editorial amendments in the scope as well as in the German version. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.