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Standard [CURRENT]

DIN EN IEC 60749-10:2023-12

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe (IEC 60749-10:2022); Deutsche Fassung EN IEC 60749-10:2022
Publication date
2023-12
Original language
German
Pages
15

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Publication date
2023-12
Original language
German
Pages
15
DOI
https://dx.doi.org/10.31030/3493624

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3493624
Replacement amendments

This document replaces DIN EN 60749-10:2003-04 .

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