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Standard [CURRENT]

DIN EN 60749-22:2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength) (IEC 60749-22:2002 + Corr. 1:2003); Deutsche Fassung EN 60749-22:2003
Publication date
2003-12
Original language
German
Pages
20
Note
The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.

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Publication date
2003-12
Original language
German
Pages
20
Note
The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.
DOI
https://dx.doi.org/10.31030/9517384

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/9517384
Replacement amendments

This document replaces DIN EN 60749:2002-09 .

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