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Standard [CURRENT]

DIN EN 60749-20-1:2009-10

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind (IEC 60749-20-1:2009); Deutsche Fassung EN 60749-20-1:2009
Publication date
2009-10
Original language
German
Pages
39
Note
The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.

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Publication date
2009-10
Original language
German
Pages
39
Note
The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.
DOI
https://dx.doi.org/10.31030/1543379

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/1543379

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