Standard [CURRENT]
DIN EN 60749-19:2011-01
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit (IEC 60749-19:2003 + A1:2010); Deutsche Fassung EN 60749-19:2003 + A1:2010
- Publication date
- 2011-01
- Original language
- German
- Pages
- 8
- Note
- The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.
- Publication date
- 2011-01
- Original language
- German
- Pages
- 8
- Note
- The publisher recommends this document in lieu of the withdrawn document DIN 41881-2:1978-06 , for which no replacement is available.
- DOI
- https://dx.doi.org/10.31030/1732791
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This part of DIN EN 60749 is intended for evaluation of integrity of materials and the process steps used to attach semiconductor-dies on package headers or other substrates (carrier tapes). In general, this test method is only applicable to components with a cavity and as a process monitor. It is not applicable to chip sizes of >10 mm2. It is also not applicable to flip-chip technology or flexible substrates. With respect to DIN EN 60749-19:2003-10, a second note in accordance with EN 60749-19/A1:2010-09 was added in clause 1, explaining the differences in the application of packages without cavity and packages with cavity. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
This document replaces DIN EN 60749-19:2003-10 .