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When designing an electrotechnical product, the risk of fire and the potential hazards associated with fires shall be taken into account and minimized as far as possible by dimensioning components, designing the circuit and selecting materials. The basic principle is to prevent any ignition or, if necessary, to contain the spread of fire. For products containing parts made of polymeric materials, Part -10-3 of the IEC 60695 series specifies a test to determine deformations caused by the temperature-induced reduction of mold stresses. The product or part is exposed to a higher temperature than the highest normal operating temperature. The resulting changes are recorded and evaluated. This second edition of IEC 60695-10-3 presents a technical revision with updated references as well as a bibliography, new features of the test equipment and further definitions of terms. It has the status of a basic safety standard according to IEC Guide 104 and ISO/IEC Guide 51. Wherever possible in the development of their own standards, it is the responsibility of the Technical Committees to apply basic safety standards. The requirements, test methods or test conditions according to these basic safety standards only apply if they are expressly referred to or adopted in the text of the corresponding standards. The responsible committee is DKE/K 133 "Prüfverfahren und Beurteilung der Brandgefahr von elektronischen Produkten und Isolierstoffen" ("Fire hazard testing of electronic products and insulating material") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
This document replaces DIN EN 60695-10-3:2003-05; VDE 0471-10-3:2003-05 .