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Standard [CURRENT]

DIN EN 60191-6-3:2001-06

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000); Deutsche Fassung EN 60191-6-3:2000
Publication date
2001-06
Original language
German
Pages
16

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Publication date
2001-06
Original language
German
Pages
16
DOI
https://dx.doi.org/10.31030/9139661

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ICS
01.100.25, 31.240
DOI
https://dx.doi.org/10.31030/9139661

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