Standard [CURRENT]
DIN EN 60191-6-21:2011-03
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
- German title
- Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP) (IEC 60191-6-21:2010); Deutsche Fassung EN 60191-6-21:2010
- Publication date
- 2011-03
- Original language
- German
- Pages
- 17
- Publication date
- 2011-03
- Original language
- German
- Pages
- 17
- DOI
- https://dx.doi.org/10.31030/1738047
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The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International Standards. It defines rules for outline drawings of surface mounted semiconductor device packages of varying package and terminal designs which are used during computer supported design and manufacturing processes. This part of DIN EN 60191 (contains or) specifies measuring methods for package dimensions of small outline packages (SOP) which correspond to outline style E according to IEC 60191-4. They have been primarily introduced on the market as TSOP or SSOP packages. The responsible Committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.