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DIN EN IEC 60749-21:2025-04 - Draft

VDE 0884-749-21:2025-04

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit (IEC 47/2862/CDV:2024); Deutsche und Englische Fassung prEN IEC 60749-21:2024
Date of issue
2025-03-28
Publication date
2025-04
Original language
German, English
Pages
43

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Date of issue
2025-03-28
Publication date
2025-04
Original language
German, English
Pages
43

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