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Draft standard [WITHDRAWN]

DIN 50003:2023-08 - Draft

Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

German title
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung
Date of issue
2023-06-30
Publication date
2023-08
Original language
German
Pages
10

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Date of issue
2023-06-30
Publication date
2023-08
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3442679

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Content
ICS
31.020, 83.180
DOI
https://dx.doi.org/10.31030/3442679
Replacement amendments

This document has been replaced by: DIN 50003:2024-06 .

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