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Standard [CURRENT]

DIN 50003:2024-06

Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

German title
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung
Publication date
2024-06
Original language
German
Pages
10

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Publication date
2024-06
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3513107

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Content
ICS
31.020, 83.180
DOI
https://dx.doi.org/10.31030/3513107

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