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Technical rule [CURRENT]

VDI/VDE 3719 Blatt 1:2021-03

Manufacturing of mechatronic integrated devices (MID) - Laser direct structuring

German title
Herstellung von mechatronisch integrierten Baugruppen (Mechatronic Integrated Devices, MID) - Laserdirektstrukturierung
Publication date
2021-03
Original language
German
Pages
21

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Publication date
2021-03
Original language
German
Pages
21

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Short description
MID technology enables the integration of mechanical, electrical, electronic, and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. This standard provides detailed information on laser direct structuring. It is aimed at users and producers of mechatronically integrated assemblies.
Content
ICS
31.220.01, 39.020
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