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Standard [CURRENT]

SN EN IEC 61189-2-807:2021-10

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-807: Prüfverfahren für Materialien für Verbindungsstrukturen – Zersetzungstemperatur (Td) unter der Nutzung von TGA
Publication date
2021-10
Original language
English
Pages
3

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Publication date
2021-10
Original language
English
Pages
3

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