Semiconductor devices - Microelectromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strenght for MEMS structures
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS - Strukturen
Publication date
2012-04
Original language
German
Pages
15
Publication date
2012-04
Original language
German
Pages
15
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