Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen
Publication date
2011-09
Original language
German
Pages
21
Publication date
2011-09
Original language
German
Pages
21
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