Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly ((IEC 60749-10:2022) EN IEC 60749-10:2022) (german version)
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe ((IEC 60749-10:2022) EN IEC 60749-10:2022) (deutsche Fassung)
Publication date
2024-01-01
Original language
German
Pages
14
Publication date
2024-01-01
Original language
German
Pages
14
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