Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson`s ratio of thin film MEMS materials (IEC 62047-21:2014) (german version)
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 21: Prüfverfahren zur Querkontraktionszahl von Dünnschichtwerkstoffen der Mikrosystemtechnik (IEC 62047-21:2014) (deutsche Fassung)
Publication date
2015-06-01
Original language
German
Pages
18
Publication date
2015-06-01
Original language
German
Pages
18
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice