Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011) (german version)
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik (IEC 62047-10:2011) (deutsche Fassung)
Publication date
2012-05-01
Original language
German
Pages
13
Publication date
2012-05-01
Original language
German
Pages
13
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