Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008)
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 38: Soft-Error-Prüfverfahren für Halbleiterbauelemente mit Speicher (IEC 60749-38:2008)
Publication date
2008-12-01
Original language
German
Pages
14
Publication date
2008-12-01
Original language
German
Pages
14
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