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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

OEVE/OENORM EN 60749-22:2004-01-01

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:2002 + Corrigendum 1:2003)

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-strength) (IEC 60749-22:2002 + Corrigendum 1:2003)
Publication date
2004-01-01
Original language
German
Pages
20

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Publication date
2004-01-01
Original language
German
Pages
20

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