Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP) (IEC 60191-6-8:2001)
Publication date
2002-07-01
Original language
German
Pages
14
Publication date
2002-07-01
Original language
German
Pages
14
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