Semiconductor devices - Micro-electromechanical devices - Part 25: silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 25: siliziumbasierte MEMS-Herstellungstechnologie - Messverfahren zur Zug-Druck- und Scherfestigkeit gebondeter Flächen im Mikrometerbereich
Publication date
2016-12-30
Original language
French
Pages
27
Publication date
2016-12-30
Original language
French
Pages
27
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