Semiconductor devices - Micro-electromechanical devices - Part 22: electromechanical tensile test method for conductive thin films on flexible substrates
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 22: Elektromechanisches Zug-Prüfverfahren für leitfähige Dünnschicten auf flexiblen Substraten
Publication date
2014-12-26
Original language
French
Pages
18
Publication date
2014-12-26
Original language
French
Pages
18
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