Semiconductor devices - Micro-electromechanical devices - Part 16: test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 16: Messverfahren zur Ermittlung der Eigenspannungen in Dünnschichten von MEMS-Bauteilen - Substratkrümmungs- und Biegebalken-Verfahren
Publication date
2015-11-14
Original language
French
Pages
15
Publication date
2015-11-14
Original language
French
Pages
15
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