Semiconductor devices - Micro-electromechanical devices - Part 13: bend- and shear- type test methods of measuring adhesive strenght for MEMS structures
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen
Publication date
2012-12-01
Original language
French
Pages
21
Publication date
2012-12-01
Original language
French
Pages
21
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice