Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik
Publication date
2012-12-01
Original language
French
Pages
15
Publication date
2012-12-01
Original language
French
Pages
15
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice