Semiconductor devices - Mechanical and climatic test methods - Part 40: board level drop test method using a strain gauge
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen
Publication date
2012-02-01
Original language
French
Pages
25
Publication date
2012-02-01
Original language
French
Pages
25
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